Optimized for high-performance applications, the TDSOURCING HPI Thermal Pad provides excellent thermal conductivity and durability. This mixed EOL (End of Life) pad is designed to meet the demanding requirements of modern electronics cooling.
Perfect for use in various electronic devices, it ensures efficient heat dissipation while maintaining a stable performance over time.
Hp Hewlett Packard 651595-001 TDSOURCING HPI Thermal Pad