ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications. Gray color; 3.5 Specific Gravity (25 degree C); 2.89 Thermal Conductivity (W/m-K); 2.0E+10 Volume Resistivity (ohm-cm); 0.032 Thermal Resistance (degrees C-cm2/W); 0.008 Bond Line Thickness (mm); <0.1 Volative Content (%); 4 grams Net Weight.
Technical Specifications
Model RG-TF4-TGU1-GP
Color Gray
Specific Gravity 3.5 Thermal Conductivity 2.89 (W/m-K)
Volume Resistivity 2.0E+10 (ohm-cm)
BLT (Bond Line Thickness) 0.008 (mm) Volatile content <0.1 (%)
