IEC+LF: Indicates compliance with IEC standards and Lead-Free (LF) packaging
Key Features: Optimized for driving power MOSFETs and IGBTs, high common-mode transient immunity, high output current drive, low input current, high speed switching
Package: DIP (Dual In-line Package)
Product Details
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Updated:
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Broadcom
HCPL-0314-060E
New
1 lbs
0 X 0 X 0
Aug 03, 2026
Dec 30, 2025
Product Identifiers:
Brand: Broadcom •
Part #: HCPL-0314-060E