CA-1X2-00M6WN-01 - Thermaltake S200 PLUS TG ARGB MID TOWER CHASSIS - SNOW

The S200 Plus TG ARGB Mid Tower Chassis combines style and performance, featuring a striking mesh front panel and a sleek tempered glass side window. This chassis is equipped with four preinstalled 120mm ARGB Lite fans that enhance cooling and aesthetics. It supports the installation of up to six 120mm fans or a 360mm radiator at the front, providing excellent cooling options. The chassis is compatible with a variety of motherboards, including Mini ITX, Micro ATX, and ATX.

On the front I/O panel, you’ll find two USB 3.0 ports and an HD audio port for convenient connectivity. The interior offers generous space for high-performance components, accommodating CPU coolers up to 166mm in height and graphics cards up to 330mm long (or 300mm with a front radiator installed). Additionally, the S200 Plus TG ARGB supports RGB lighting control software compatible with major motherboard brands such as ASUS, GIGABYTE, MSI, and ASRock.

The Thermaltake S200 Plus TG ARGB Mid Tower Chassis - Snow is a computer case designed for system builders and IT professionals requiring a balance of cooling performance and component visibility. This mid-tower chassis features an airflow-optimized mesh front panel and a tempered glass side window, allowing for efficient heat dissipation and clear viewing of internal components. It comes equipped with four preinstalled 120mm ARGB Lite fans to facilitate immediate cooling and aesthetic integration. The design supports flexible cooling configurations, including up to six 120mm fans or a 360mm front radiator. Compatibility extends to Mini ITX, Micro ATX, and ATX motherboards, accommodating a range of system builds. Front I/O includes two USB 3.0 ports and an HD audio port for convenient peripheral connectivity. The chassis provides internal space for CPU coolers up to 166mm tall and graphics cards up to 330mm long (300mm with a front radiator). This product, part number CA-1X2-00M6WN-01, is suitable for deploying workstations or specialized systems where component visibility and thermal management are key considerations.