The HP C7000 Enclosure is designed to provide a robust platform for data center applications. With the ability to support up to 16 half-height blades and dual Virtualized Converged Fabric Face Plate (VCFF), this enclosure ensures high availability and performance.
Featuring advanced cooling and power management capabilities, the C7000 enclosure is perfect for organizations looking to enhance their infrastructure while optimizing energy efficiency.
Hp 714684-S21 C7000 Enclosure with 16xIC and Dual VCFF Support