This upgrade kit enhances the performance of thin card picking in applications requiring card thicknesses between 10 to 22 mils. Designed specifically for the DS1 and DS2 systems, this kit optimizes the existing hardware for better accommodation of thin cards.
Note: Card lamination and tactile impression modules do not support thin cards, regardless of this upgrade.
Entrust 531732-002 Thin Card Upgrade Kit for DS1/DS2